Mechanical Reliability of a Segmented Silicon Layer on Ultra-Thin Polyimide Substrates: Fid-Bau Portal

Mechanical Reliability of a Segmented Silicon Layer on Ultra-Thin Polyimide Substrates

Wang, L. / Xiao, A. / Jansen, K.M.B. / Bartek, M. / Zoumpoulidis, T. / Ernst, L.J. / Zhang, G.Q.

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Mechanical Reliability of a Segmented Silicon Layer on Ultra-Thin Polyimide Substrates

Wang, L. / Xiao, A. / Jansen, K.M.B. / Bartek, M. / Zoumpoulidis, T. / Ernst, L.J. / Zhang, G.Q.

Mechanical Reliability of a Segmented Silicon Layer on Ultra-Thin Polyimide Substrates

Wang, L. / Xiao, A. / Jansen, K.M.B. / Bartek, M. / Zoumpoulidis, T. / Ernst, L.J. / Zhang, G.Q.

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Title:

Mechanical Reliability of a Segmented Silicon Layer on Ultra-Thin Polyimide Substrates

Contributors:

Wang, L. (author) / Xiao, A. (author) / Jansen, K.M.B. (author) / Bartek, M. (author) / Zoumpoulidis, T. (author) / Ernst, L.J. (author) / Zhang, G.Q. (author) / Zhou, Y. / Tu, S.-T. / Xie, X.

Published in:

Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2529-2532

KEY ENGINEERING MATERIALS ; 353/358

Publication date:

2007-01-01

Size:

4 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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