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    Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

    New search for: Chang, C.C.
    New search for: Yang, S.C.
    New search for: Chen, Y.J.
    New search for: Kao, C.R.

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    Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

    New search for: Chang, C.C.
    New search for: Yang, S.C.
    New search for: Chen, Y.J.
    New search for: Kao, C.R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

    New search for: Chang, C.C.
    New search for: Yang, S.C.
    New search for: Chen, Y.J.
    New search for: Kao, C.R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

    Contributors:

    Chang, C.C. (author) / Yang, S.C. (author) / Chen, Y.J. (author) / Kao, C.R. (author)

    Published in:

    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 102 ; 579-583

    Publication date:

    2011-01-01

    Size:

    5 pages

    ISSN:

    1862-5282

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669.9

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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