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Field emission property of copper nitride thin film deposited by reactive magnetron sputtering

Wang, T. / Pan, X. J. / Wang, X. M. / Duan, H. G. / Li, R. S. / Li, H. / Xie, E. Q.

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Field emission property of copper nitride thin film deposited by reactive magnetron sputtering

Wang, T. / Pan, X. J. / Wang, X. M. / Duan, H. G. / Li, R. S. / Li, H. / Xie, E. Q.

Field emission property of copper nitride thin film deposited by reactive magnetron sputtering

Wang, T. / Pan, X. J. / Wang, X. M. / Duan, H. G. / Li, R. S. / Li, H. / Xie, E. Q.

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Check availability in my library

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Document information

Title:

Field emission property of copper nitride thin film deposited by reactive magnetron sputtering

Contributors:

Wang, T. (author) / Pan, X. J. (author) / Wang, X. M. (author) / Duan, H. G. (author) / Li, R. S. (author) / Li, H. (author) / Xie, E. Q. (author)

Published in:

APPLIED SURFACE SCIENCE ; 254 ; 6817-6819

Publication date:

2008-01-01

Size:

3 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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