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Failure mode analysis of lead-free solder joints under high speed impact testing
Failure mode analysis of lead-free solder joints under high speed impact testing
Failure mode analysis of lead-free solder joints under high speed impact testing
Liu, D. S. (author) / Kuo, C. Y. (author) / Hsu, C. L. (author) / Shen, G. S. (author) / Chen, Y. R. (author) / Lo, K. C. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 494 ; 196-202
2008-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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