A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS: Fid-Bau Portal

A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS

Liu, D. S. / Kuo, C. Y. / Hsu, C. L. / Chung, C. L.

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A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS

Liu, D. S. / Kuo, C. Y. / Hsu, C. L. / Chung, C. L.

A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS

Liu, D. S. / Kuo, C. Y. / Hsu, C. L. / Chung, C. L.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS

Contributors:

Liu, D. S. (author) / Kuo, C. Y. (author) / Hsu, C. L. (author) / Chung, C. L. (author)

Published in:

EXPERIMENTAL TECHNIQUES ; 34 ; 68-73

Publication date:

2010-01-01

Size:

6 pages

ISSN:

0732-8818

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Liu, D. S. / Kuo, C. Y. / Hsu, C. L. et al. | British Library Online Contents | 2008

The micro-impact fracture behavior of lead-free solder ball joints

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Thermomigration in lead-free solder joints

Abdulhamid, M.F. / Li, S. / Basaran, C. | British Library Online Contents | 2008

Thermomigration in lead-free solder joints

Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal | British Library Online Contents | 2008

Solderability Testing of Lead-Free Solder Joints Using Miniature Specimens

Rosenthal, Y. / Sabag, O. / Tourgeman, A. et al. | British Library Online Contents | 2008