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A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS
A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS
A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS
Liu, D. S. (author) / Kuo, C. Y. (author) / Hsu, C. L. (author) / Chung, C. L. (author)
EXPERIMENTAL TECHNIQUES ; 34 ; 68-73
2010-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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