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    Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading

    New search for: Hsu, H.C.
    New search for: Lee, H.Y.
    New search for: Shieh, W.L.

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    Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading

    New search for: Hsu, H.C.
    New search for: Lee, H.Y.
    New search for: Shieh, W.L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading

    New search for: Hsu, H.C.
    New search for: Lee, H.Y.
    New search for: Shieh, W.L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading

    Contributors:

    Hsu, H.C. (author) / Lee, H.Y. (author) / Shieh, W.L. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 594 ; 175-180

    Publication date:

    2008-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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