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    Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

    New search for: Gong, J.
    New search for: Liu, C.
    New search for: Conway, P. P.
    New search for: Silberschmidt, V. V.

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    Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

    New search for: Gong, J.
    New search for: Liu, C.
    New search for: Conway, P. P.
    New search for: Silberschmidt, V. V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

    New search for: Gong, J.
    New search for: Liu, C.
    New search for: Conway, P. P.
    New search for: Silberschmidt, V. V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

    Contributors:

    Gong, J. (author) / Liu, C. (author) / Conway, P. P. (author) / Silberschmidt, V. V. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 39 ; 187-197

    Publication date:

    2007-01-01

    Size:

    11 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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