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Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy
Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy
Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy
Chou, Tzu-Ting (author) / Song, Rui-Wen (author) / Chen, Wei-Yu (author) / Duh, Jenq-Gong (author)
MATERIALS LETTERS ; 235 ; 180-183
2019-01-01
4 pages
Article (Journal)
Unknown
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