Electric Flame-Off Characteristics and Fracture Properties of 20 μm Thin Copper Bonding Wire: Fid-Bau Portal

Electric Flame-Off Characteristics and Fracture Properties of 20 μm Thin Copper Bonding Wire

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. / Lin, Y.-C.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Electric Flame-Off Characteristics and Fracture Properties of 20 μm Thin Copper Bonding Wire

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. / Lin, Y.-C.

Electric Flame-Off Characteristics and Fracture Properties of 20 μm Thin Copper Bonding Wire

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. / Lin, Y.-C.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Electric Flame-Off Characteristics and Fracture Properties of 20 μm Thin Copper Bonding Wire

Contributors:

Hung, F.-Y. (author) / Lui, T.-S. (author) / Chen, L.-H. (author) / Lin, Y.-C. (author)

Published in:

MATERIALS TRANSACTIONS ; 50 ; 293-298

Publication date:

2009-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Hung, F. Y. / Lui, T. S. / Chen, L. H. et al. | British Library Online Contents | 2007

Recrystallization Effect and Electric Flame-Off Characteristic of Thin Copper Wire

Hung, F.-Y. / Wang, Y.-T. / Chen, L.-H. et al. | British Library Online Contents | 2006

Texture Analysis of Copper Bonding Wire

Baeck, S. M. / Park, K. K. / Ha, H. et al. | British Library Online Contents | 2002

Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method

Bang, H.S. / Ji, H.J. / Li, M.Y. et al. | British Library Online Contents | 2008

Evaluation of bonding characteristics of deformed wire

Jensen, R.S. / Kesler, C.E. | Engineering Index Backfile | 1964