Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive): Fid-Bau Portal

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. / Lee, S.H. / Kim, J. / Han, J.-G. / Eom, Y.-S. / Shin, Y.-E.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. / Lee, S.H. / Kim, J. / Han, J.-G. / Eom, Y.-S. / Shin, Y.-E.

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. / Lee, S.H. / Kim, J. / Han, J.-G. / Eom, Y.-S. / Shin, Y.-E.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

Contributors:

Yim, B.-S. (author) / Kim, J.-M. (author) / Jeon, S.-H. (author) / Lee, S.H. (author) / Kim, J. (author) / Han, J.-G. (author) / Eom, Y.-S. (author) / Shin, Y.-E. (author)

Published in:

MATERIALS TRANSACTIONS ; 50 ; 1684-1689

Publication date:

2009-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Lee, J.W. / Lee, S.H. / Kim, J.-M. et al. | British Library Online Contents | 2008

Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)

Yim, B.-S. / Oh, S.-H. / Kim, J. et al. | British Library Online Contents | 2012

Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. et al. | British Library Online Contents | 2009

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)

Lee, S.H. / Lee, J.H. / Lee, J.W. et al. | British Library Online Contents | 2008

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Kim, J.-W. / Kim, D.-G. / Koo, J.-M. et al. | British Library Online Contents | 2007