Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization: Fid-Bau Portal

Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

Wang, K.-J. / Tsai, Y.-Z. / Duh, J.-G. / Shih, T.-Y.

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Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

Wang, K.-J. / Tsai, Y.-Z. / Duh, J.-G. / Shih, T.-Y.

Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

Wang, K.-J. / Tsai, Y.-Z. / Duh, J.-G. / Shih, T.-Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

Contributors:

Wang, K.-J. (author) / Tsai, Y.-Z. (author) / Duh, J.-G. (author) / Shih, T.-Y. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 24 ; 2638-2643

Publication date:

2009-01-01

Size:

6 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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