Effects of Cr dopant on the microstructure and electromigration performance of Cu interconnects: Fid-Bau Portal

Effects of Cr dopant on the microstructure and electromigration performance of Cu interconnects

Wang, X. / Dong, X. / Wu, J.

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Effects of Cr dopant on the microstructure and electromigration performance of Cu interconnects

Wang, X. / Dong, X. / Wu, J.

Effects of Cr dopant on the microstructure and electromigration performance of Cu interconnects

Wang, X. / Dong, X. / Wu, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effects of Cr dopant on the microstructure and electromigration performance of Cu interconnects

Contributors:

Wang, X. (author) / Dong, X. (author) / Wu, J. (author)

Published in:

APPLIED SURFACE SCIENCE ; 255 ; 9273-9278

Publication date:

2009-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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