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Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints
Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints
Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints
McDougall, J. (author) / Choi, S. (author) / Bieler, T. R. (author) / Subramanian, K. N. (author) / Lucas, J. P. (author)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 285 ; 25 - 34
2000-01-01
10 pages
Article (Journal)
English
DDC:
620.11
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