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    Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

    New search for: Song, J.-M.
    New search for: Su, C.-W.
    New search for: Lai, Y.-S.
    New search for: Chiu, Y.-T.

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    Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

    New search for: Song, J.-M.
    New search for: Su, C.-W.
    New search for: Lai, Y.-S.
    New search for: Chiu, Y.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

    New search for: Song, J.-M.
    New search for: Su, C.-W.
    New search for: Lai, Y.-S.
    New search for: Chiu, Y.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

    Contributors:

    Song, J.-M. (author) / Su, C.-W. (author) / Lai, Y.-S. (author) / Chiu, Y.-T. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 629-632

    Publication date:

    2010-01-01

    Size:

    4 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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