Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints
Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints
Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints
Song, J.-M. (Autor:in) / Su, C.-W. (Autor:in) / Lai, Y.-S. (Autor:in) / Chiu, Y.-T. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 629-632
01.01.2010
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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