A platform for research: civil engineering, architecture and urbanism
Corrosion and Protection of SnAgCu Solder Powders in Organic Acid Solutions
Corrosion and Protection of SnAgCu Solder Powders in Organic Acid Solutions
Corrosion and Protection of SnAgCu Solder Powders in Organic Acid Solutions
Li, T. (author) / Zhao, M.-q. (author) / Lu, J.-f. (author) / Xue, J. (author)
MATERIALS PROTECTION -WUHAN- ; 43 ; 13-15
2010-01-01
3 pages
Article (Journal)
Unknown
DDC:
620.1
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Recrystallization behaviour of SnAgCu solder joints
British Library Online Contents | 2008
|Mechanical and microstructural properties of SnAgCu solder joints
British Library Online Contents | 2006
|Electrochemical Corrosion Behavior of SnAgCu and SnPb Solder Alloys in Solution with Activator
British Library Online Contents | 2010
|Formation of Ag3Sn plates in SnAgCu solder bumps
British Library Online Contents | 2010
|Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys
British Library Online Contents | 2015
|