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    Chemical effect on the material removal rate in the CMP of silicon wafers

    New search for: Wang, Y. G.
    New search for: Zhang, L. C.
    New search for: Biddut, A.

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    Chemical effect on the material removal rate in the CMP of silicon wafers

    New search for: Wang, Y. G.
    New search for: Zhang, L. C.
    New search for: Biddut, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Chemical effect on the material removal rate in the CMP of silicon wafers

    New search for: Wang, Y. G.
    New search for: Zhang, L. C.
    New search for: Biddut, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Chemical effect on the material removal rate in the CMP of silicon wafers

    Contributors:

    Wang, Y. G. (author) / Zhang, L. C. (author) / Biddut, A. (author)

    Published in:

    WEAR -LAUSANNE- ; 270 ; 312-316

    Publication date:

    2011-01-01

    Size:

    5 pages

    ISSN:

    0043-1648

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11292

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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