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Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing
Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing
Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing
Coetsier, C. M. (author) / Testa, F. (author) / Carretier, E. (author) / Ennahali, M. (author) / Laborie, B. (author) / Mouton-arnaud, C. (author) / Fluchere, O. (author) / Moulin, P. (author)
APPLIED SURFACE SCIENCE ; 257 ; 6163-6170
2011-01-01
8 pages
Article (Journal)
English
DDC:
621.35
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