Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing
Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing
Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing
Coetsier, C. M. (Autor:in) / Testa, F. (Autor:in) / Carretier, E. (Autor:in) / Ennahali, M. (Autor:in) / Laborie, B. (Autor:in) / Mouton-arnaud, C. (Autor:in) / Fluchere, O. (Autor:in) / Moulin, P. (Autor:in)
APPLIED SURFACE SCIENCE ; 257 ; 6163-6170
01.01.2011
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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