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Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry

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Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry

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Document information

Title:

Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry

Published in:

APPLIED SURFACE SCIENCE ; 337 ; 130-137

Publication date:

2015-01-01

Size:

8 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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