Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Interface between Sn-Sb-Cu solder and copper substrate

    New search for: Sebo, P.
    New search for: Svec, P.
    New search for: Janickovic, D.
    New search for: Illekova, E.
    New search for: Plevachuk, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Interface between Sn-Sb-Cu solder and copper substrate

    New search for: Sebo, P.
    New search for: Svec, P.
    New search for: Janickovic, D.
    New search for: Illekova, E.
    New search for: Plevachuk, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interface between Sn-Sb-Cu solder and copper substrate

    New search for: Sebo, P.
    New search for: Svec, P.
    New search for: Janickovic, D.
    New search for: Illekova, E.
    New search for: Plevachuk, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Interface between Sn-Sb-Cu solder and copper substrate

    Contributors:

    Sebo, P. (author) / Svec, P. (author) / Janickovic, D. (author) / Illekova, E. (author) / Plevachuk, Y. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 528 ; 5955-5960

    Publication date:

    2011-01-01

    Size:

    6 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermomechanical Behavior of Underfill/Solder Mask/ Substrate Interface Under Thermal Cycling

    Chien, C.-H. / Chen, Y.-C. / Hsieh, C.-C. et al. | British Library Online Contents | 2004

    Activation energies of intermetallic compound growth at interface between Sn-5Bi-3·5Ag solder and Cu substrate

    Yoon, J.-W. / Lee, C.-B. / Jung, S.-B. | British Library Online Contents | 2003

    Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder

    Chang, T. C. / Hon, M. H. / Wang, M. C. | British Library Online Contents | 2003

    Interfacial reactions between eutectic Sn–Pb solder and Co substrate

    Wang, C. h. / Kuo, C. y. | British Library Online Contents | 2011

    Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

    Tsukamoto, H. / Dong, Z.G. / Huang, H. et al. | British Library Online Contents | 2010

    Back to top