Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Formation of interfacial eta '-Cu~6Sn~5 in Sn-0.7Cu/Cu solder joints during isothermal aging

    New search for: Luo, Z.
    New search for: Wang, L.
    New search for: Fu, Q.
    New search for: Cheng, C.
    New search for: Zhao, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Formation of interfacial eta '-Cu~6Sn~5 in Sn-0.7Cu/Cu solder joints during isothermal aging

    New search for: Luo, Z.
    New search for: Wang, L.
    New search for: Fu, Q.
    New search for: Cheng, C.
    New search for: Zhao, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Formation of interfacial eta '-Cu~6Sn~5 in Sn-0.7Cu/Cu solder joints during isothermal aging

    New search for: Luo, Z.
    New search for: Wang, L.
    New search for: Fu, Q.
    New search for: Cheng, C.
    New search for: Zhao, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Formation of interfacial eta '-Cu~6Sn~5 in Sn-0.7Cu/Cu solder joints during isothermal aging

    Contributors:

    Luo, Z. (author) / Wang, L. (author) / Fu, Q. (author) / Cheng, C. (author) / Zhao, J. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 1468-1471

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

    Bae, K.-S. / Kim, S.-J. | British Library Online Contents | 2002

    Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

    Zhang, K.K. / Wang, Y.L. / Fan, Y.L. et al. | British Library Online Contents | 2010

    The Morphology and Evolution of Cu~6Sn~5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

    Wang, Y.L. / Zhang, K.K. / Li, C.Y. et al. | British Library Online Contents | 2012

    Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints

    Wang, X.J. / Zeng, Q.L. / Zhu, Q.S. et al. | British Library Online Contents | 2010

    Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging

    Yu, C. Y. / Duh, J. G. | British Library Online Contents | 2012

    Back to top