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Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures
Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures
Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures
Fayad, W. R. (author) / Andleigh, V. K. (author) / Thompson, C. V. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 413-416
2001-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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