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    Effect of low k dielectrics on electromigration reliability for Cu interconnects

    New search for: Ho, P. S.
    New search for: Lee, K. D.
    New search for: Yoon, S.
    New search for: Lu, X.
    New search for: Ogawa, E. T.

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    Effect of low k dielectrics on electromigration reliability for Cu interconnects

    New search for: Ho, P. S.
    New search for: Lee, K. D.
    New search for: Yoon, S.
    New search for: Lu, X.
    New search for: Ogawa, E. T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of low k dielectrics on electromigration reliability for Cu interconnects

    New search for: Ho, P. S.
    New search for: Lee, K. D.
    New search for: Yoon, S.
    New search for: Lu, X.
    New search for: Ogawa, E. T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of low k dielectrics on electromigration reliability for Cu interconnects

    Contributors:

    Ho, P. S. (author) / Lee, K. D. (author) / Yoon, S. (author) / Lu, X. (author) / Ogawa, E. T. (author)

    Published in:

    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 7 ; 157-163

    Publication date:

    2004-01-01

    Size:

    7 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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