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    Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint

    New search for: Zeng, Z.
    New search for: Li, X.B.
    New search for: Li, L.
    New search for: Wang, Z.H.

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    Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint

    New search for: Zeng, Z.
    New search for: Li, X.B.
    New search for: Li, L.
    New search for: Wang, Z.H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint

    New search for: Zeng, Z.
    New search for: Li, X.B.
    New search for: Li, L.
    New search for: Wang, Z.H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint

    Contributors:

    Zeng, Z. (author) / Li, X.B. (author) / Li, L. (author) / Wang, Z.H. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 27 ; 1686-1693

    Publication date:

    2011-01-01

    Size:

    8 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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