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    Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

    New search for: Fuchs, C.
    New search for: Schreck, T.
    New search for: Kaloudis, M.

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    Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

    New search for: Fuchs, C.
    New search for: Schreck, T.
    New search for: Kaloudis, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

    New search for: Fuchs, C.
    New search for: Schreck, T.
    New search for: Kaloudis, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

    Contributors:

    Fuchs, C. (author) / Schreck, T. (author) / Kaloudis, M. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 47 ; 4036-4041

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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