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Characteristics of germanium dry etching using inductively coupled SF"6 plasma

Shim, K. H. / Kil, Y. H. / Yang, H. D. / Park, B. K. / Yang, J. H. / Kang, S. / Jeong, T. S. / Kim, T. S.

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Characteristics of germanium dry etching using inductively coupled SF"6 plasma

Shim, K. H. / Kil, Y. H. / Yang, H. D. / Park, B. K. / Yang, J. H. / Kang, S. / Jeong, T. S. / Kim, T. S.

Characteristics of germanium dry etching using inductively coupled SF"6 plasma

Shim, K. H. / Kil, Y. H. / Yang, H. D. / Park, B. K. / Yang, J. H. / Kang, S. / Jeong, T. S. / Kim, T. S.

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Document information

Title:

Characteristics of germanium dry etching using inductively coupled SF"6 plasma

Contributors:

Shim, K. H. (author) / Kil, Y. H. (author) / Yang, H. D. (author) / Park, B. K. (author) / Yang, J. H. (author) / Kang, S. (author) / Jeong, T. S. (author) / Kim, T. S. (author)

Published in:

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 15 ; 364-370

Publication date:

2012-01-01

Size:

7 pages

ISSN:

1369-8001

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.38152

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