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    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

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    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    New search for: Wang, M.
    New search for: Wang, J.
    New search for: Feng, H.
    New search for: Ke, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    New search for: Wang, M.
    New search for: Wang, J.
    New search for: Feng, H.
    New search for: Ke, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    Contributors:

    Wang, M. (author) / Wang, J. (author) / Feng, H. (author) / Ke, W. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 558 ; 649-655

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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