Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    New search for: Wang, Mingna
    New search for: Wang, Jianqiu
    New search for: Feng, Hao
    New search for: Ke, Wei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    New search for: Wang, Mingna
    New search for: Wang, Jianqiu
    New search for: Feng, Hao
    New search for: Ke, Wei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    New search for: Wang, Mingna
    New search for: Wang, Jianqiu
    New search for: Feng, Hao
    New search for: Ke, Wei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    Contributors:

    Wang, Mingna (author) / Wang, Jianqiu (author) / Feng, Hao (author) / Ke, Wei (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 558 ; 649-655

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

    Wang, M. / Wang, J. / Feng, H. et al. | British Library Online Contents | 2012

    A Green Approach to Synthesis of Nanoparticles of Sn-3.0Ag-0.5Cu Lead-Free Solder Alloy

    Pang, S.-k. / Yung, K.-c. | British Library Online Contents | 2012

    Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

    Gao, F. / Cheng, F. / Nishikawa, H. et al. | British Library Online Contents | 2008

    Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

    Yokoyama, K. i. / Tsuji, D. / Sakai, J. i. | British Library Online Contents | 2011

    Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

    Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri et al. | British Library Online Contents | 2016

    Back to top