Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Ho, C. Y. / Duh, J. G. / Lin, C. W. / Lin, C. J. / Wu, Y. H. / Hong, H. C. / Wang, T. H.

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Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Ho, C. Y. / Duh, J. G. / Lin, C. W. / Lin, C. J. / Wu, Y. H. / Hong, H. C. / Wang, T. H.

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Ho, C. Y. / Duh, J. G. / Lin, C. W. / Lin, C. J. / Wu, Y. H. / Hong, H. C. / Wang, T. H.

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Title:

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Contributors:

Ho, C. Y. (author) / Duh, J. G. (author) / Lin, C. W. (author) / Lin, C. J. (author) / Wu, Y. H. (author) / Hong, H. C. (author) / Wang, T. H. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 48 ; 2724-2732

Publication date:

2013-01-01

Size:

9 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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