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Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints
Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints
Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints
Lee, K. O. (author) / Yu, J. (author) / Park, T. S. (author) / Lee, S. B. (author)
INTERNATIONAL JOURNAL OF FATIGUE ; 48 ; 1-8
2013-01-01
8 pages
Article (Journal)
English
DDC:
620.1126
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