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    Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

    New search for: Kadoguchi, T.
    New search for: Take, N.
    New search for: Yamanaka, K.
    New search for: Nagao, S.
    New search for: Suganuma, K.

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    Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

    New search for: Kadoguchi, T.
    New search for: Take, N.
    New search for: Yamanaka, K.
    New search for: Nagao, S.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

    New search for: Kadoguchi, T.
    New search for: Take, N.
    New search for: Yamanaka, K.
    New search for: Nagao, S.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

    Contributors:

    Kadoguchi, T. (author) / Take, N. (author) / Yamanaka, K. (author) / Nagao, S. (author) / Suganuma, K. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 52 ; 3244-3254

    Publication date:

    2017-01-01

    Size:

    11 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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