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    Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework

    New search for: Sun, H.
    New search for: Yang, F.
    New search for: Wang, W.
    New search for: Zhang, D.C.
    New search for: Tang, F.

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    Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework

    New search for: Sun, H.
    New search for: Yang, F.
    New search for: Wang, W.
    New search for: Zhang, D.C.
    New search for: Tang, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework

    New search for: Sun, H.
    New search for: Yang, F.
    New search for: Wang, W.
    New search for: Zhang, D.C.
    New search for: Tang, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework

    Contributors:

    Sun, H. (author) / Yang, F. (author) / Wang, W. (author) / Zhang, D.C. (author) / Tang, F.

    Published in:

    Micro-Nano Technology XIV ; 1103-1106

    KEY ENGINEERING MATERIALS ; 562/565

    Publication date:

    2013-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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