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Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework
Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework
Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework
Sun, H. (author) / Yang, F. (author) / Wang, W. (author) / Zhang, D.C. (author) / Tang, F.
2013-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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