Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process: Fid-Bau Portal

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Kang, S. K. / Cho, M. G. / Lauro, P. / Shih, D.-Y.

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Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Kang, S. K. / Cho, M. G. / Lauro, P. / Shih, D.-Y.

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Kang, S. K. / Cho, M. G. / Lauro, P. / Shih, D.-Y.

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Check availability in my library

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Document information

Title:

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Contributors:

Kang, S. K. (author) / Cho, M. G. (author) / Lauro, P. (author) / Shih, D.-Y. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 557-560

Publication date:

2007-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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