Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study: Fid-Bau Portal

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Yao, W. / Basaran, C.

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Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Yao, W. / Basaran, C.

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Yao, W. / Basaran, C.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

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Dokumentinformationen

Titel:

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Beteiligte:

Yao, W. (Autor:in) / Basaran, C. (Autor:in)

Erschienen in:

INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 23 ; 203-221

Erscheinungsdatum:

01.01.2014

Format / Umfang:

19 pages

ISSN:

1056-7895

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1

Basaran, C. / Abdulhamid, M. F. | British Library Online Contents | 2009

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Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. | British Library Online Contents | 2008

Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model

Yao, W. / Basaran, C. | British Library Online Contents | 2013

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