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    Effect of TiO"2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection

    New search for: Hu, X.
    New search for: Xu, S.
    New search for: Yang, Y.
    New search for: Chen, Z.
    New search for: Chan, Y. C.

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    Effect of TiO"2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection

    New search for: Hu, X.
    New search for: Xu, S.
    New search for: Yang, Y.
    New search for: Chen, Z.
    New search for: Chan, Y. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of TiO"2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection

    New search for: Hu, X.
    New search for: Xu, S.
    New search for: Yang, Y.
    New search for: Chen, Z.
    New search for: Chan, Y. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of TiO"2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection

    Contributors:

    Hu, X. (author) / Xu, S. (author) / Yang, Y. (author) / Chen, Z. (author) / Chan, Y. C. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 600 ; 67-75

    Publication date:

    2014-01-01

    Size:

    9 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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