A platform for research: civil engineering, architecture and urbanism
The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization
The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization
The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization
APPLIED SURFACE SCIENCE ; 328 ; 374-379
2015-01-01
6 pages
Article (Journal)
English
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2000
|Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization
British Library Online Contents | 2003
|Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization
British Library Online Contents | 2009
|British Library Online Contents | 1996
|Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
British Library Online Contents | 2017
|