The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization: Fid-Bau Portal

The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization

Yu, Z. / Ren, R. / Xue, J. / Yao, Q. / Li, Z. / Hui, G. / Xue, W.

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The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization

Yu, Z. / Ren, R. / Xue, J. / Yao, Q. / Li, Z. / Hui, G. / Xue, W.

The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization

Yu, Z. / Ren, R. / Xue, J. / Yao, Q. / Li, Z. / Hui, G. / Xue, W.

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Check availability in my library

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Document information

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Document information

Title:

The role of oxygen in the deposition of copper-calcium thin film as diffusion barrier for copper metallization

Contributors:

Yu, Z. (author) / Ren, R. (author) / Xue, J. (author) / Yao, Q. (author) / Li, Z. (author) / Hui, G. (author) / Xue, W. (author)

Published in:

APPLIED SURFACE SCIENCE ; 328 ; 374-379

Publication date:

2015-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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