Tantalum diffusion barrier grown by inorganic plasma-promoted chemical vapor deposition: Performance in copper metallization

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Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization

Maury, F. / Gasqueres, C. / Duminica, F.-D. et al. | British Library Online Contents | 2003

Electrical characterization of reactively sputtered TiN diffusion barrier layers for copper metallization

Kaufmann, C. / Baumann, J. / Gessner, T. et al. | British Library Online Contents | 1996

Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization

Tripathi, C. C. / Kumar, M. / Kumar, D. | British Library Online Contents | 2009

Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization

Wang, Yuechun / Chen, Xiuhua / Ma, Wenhui et al. | British Library Online Contents | 2017