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    Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

    New search for: Hu, Xiaowu
    New search for: Xu, Tao
    New search for: Keer, Leon M.
    New search for: Li, Yulong
    New search for: Jiang, Xiongxin

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    Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

    New search for: Hu, Xiaowu
    New search for: Xu, Tao
    New search for: Keer, Leon M.
    New search for: Li, Yulong
    New search for: Jiang, Xiongxin

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

    New search for: Hu, Xiaowu
    New search for: Xu, Tao
    New search for: Keer, Leon M.
    New search for: Li, Yulong
    New search for: Jiang, Xiongxin

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

    Contributors:

    Hu, Xiaowu (author) / Xu, Tao (author) / Keer, Leon M. (author) / Li, Yulong (author) / Jiang, Xiongxin (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 673 ; 167-177

    Publication date:

    2016-01-01

    Size:

    11 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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