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Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints
Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints
Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints
Hu, X. (author) / Xu, T. (author) / Keer, L. M. (author) / Li, Y. (author) / Jiang, X. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 673 ; 167-177
2016-01-01
11 pages
Article (Journal)
English
DDC:
620.11
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