Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    GaN Schottky barrier diode with thermally stable nickel nitride electrode deposited by reactive sputtering

    New search for: Li, Xiaobo
    New search for: Hoshi, Taiki
    New search for: Li, Liuan
    New search for: Pu, Taofei
    New search for: Zhang, Tong
    New search for: Xie, Tian
    New search for: Li, Xianjie
    New search for: Ao, Jin-Ping

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    GaN Schottky barrier diode with thermally stable nickel nitride electrode deposited by reactive sputtering

    New search for: Li, Xiaobo
    New search for: Hoshi, Taiki
    New search for: Li, Liuan
    New search for: Pu, Taofei
    New search for: Zhang, Tong
    New search for: Xie, Tian
    New search for: Li, Xianjie
    New search for: Ao, Jin-Ping

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    GaN Schottky barrier diode with thermally stable nickel nitride electrode deposited by reactive sputtering

    New search for: Li, Xiaobo
    New search for: Hoshi, Taiki
    New search for: Li, Liuan
    New search for: Pu, Taofei
    New search for: Zhang, Tong
    New search for: Xie, Tian
    New search for: Li, Xianjie
    New search for: Ao, Jin-Ping

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    GaN Schottky barrier diode with thermally stable nickel nitride electrode deposited by reactive sputtering

    Contributors:

    Li, Xiaobo (author) / Hoshi, Taiki (author) / Li, Liuan (author) / Pu, Taofei (author) / Zhang, Tong (author) / Xie, Tian (author) / Li, Xianjie (author) / Ao, Jin-Ping (author)

    Published in:

    Materials science in semiconductor processing ; 93 ; 1-5

    Publication date:

    2019-01-01

    Size:

    5 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Titanium Nitride - Silicon Nitride Composite Coatings Deposited by Reactive Magnetron Sputtering

    Patscheider, J. / Diserens, M. / Levy, F. | British Library Online Contents | 1998

    Tribological characterization of tungsten nitride coatings deposited by reactive magnetron sputtering

    Polcar, T. / Parreira, N. M. / Cavaleiro, A. | British Library Online Contents | 2007

    Microstresses in Molybdenum Nitride Thin Films Deposited by Reactive DC Magnetron Sputtering

    Shen, Y. G. | British Library Online Contents | 2005

    Influence of bias voltage on copper nitride films deposited by reactive sputtering

    Pierson, J. F. | British Library Online Contents | 2003

    Field emission property of copper nitride thin film deposited by reactive magnetron sputtering

    Wang, T. / Pan, X. J. / Wang, X. M. et al. | British Library Online Contents | 2008

    Back to top