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    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    New search for: Tsao, L.C.
    New search for: Chang, S.Y.

    AbstractFor development of a lead-free composite solder for advance electrical components, a series of Sn3.5Ag0.25Cu (SAC) solders containing TiO2 nanopowders have been studied. The results showed that the addition of 0.25–1 wt.% TiO2 nanopowders into the lead-free SAC solder caused its liquidus temperature to increase by about 3.5–5.9°C. Metallographic observations of the lead-free SAC composite solders revealed a reduction in the grain size of β-Sn, Ag3Sn phase and Ag3Sn phase located between the spacing lamellae. In terms of mechanical behavior, the addition of larger weight fractions of TiO2 nanopowders in lead-free SAC solder matrix led to an improvement in microhardness, 0.2%YS and UTS. However, ductility of the lead-free SAC composite solders was observed to decrease.

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    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    New search for: Tsao, L.C.
    New search for: Chang, S.Y.

    AbstractFor development of a lead-free composite solder for advance electrical components, a series of Sn3.5Ag0.25Cu (SAC) solders containing TiO2 nanopowders have been studied. The results showed that the addition of 0.25–1 wt.% TiO2 nanopowders into the lead-free SAC solder caused its liquidus temperature to increase by about 3.5–5.9°C. Metallographic observations of the lead-free SAC composite solders revealed a reduction in the grain size of β-Sn, Ag3Sn phase and Ag3Sn phase located between the spacing lamellae. In terms of mechanical behavior, the addition of larger weight fractions of TiO2 nanopowders in lead-free SAC solder matrix led to an improvement in microhardness, 0.2%YS and UTS. However, ductility of the lead-free SAC composite solders was observed to decrease.

    Access

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    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    New search for: Tsao, L.C.
    New search for: Chang, S.Y.

    AbstractFor development of a lead-free composite solder for advance electrical components, a series of Sn3.5Ag0.25Cu (SAC) solders containing TiO2 nanopowders have been studied. The results showed that the addition of 0.25–1 wt.% TiO2 nanopowders into the lead-free SAC solder caused its liquidus temperature to increase by about 3.5–5.9°C. Metallographic observations of the lead-free SAC composite solders revealed a reduction in the grain size of β-Sn, Ag3Sn phase and Ag3Sn phase located between the spacing lamellae. In terms of mechanical behavior, the addition of larger weight fractions of TiO2 nanopowders in lead-free SAC solder matrix led to an improvement in microhardness, 0.2%YS and UTS. However, ductility of the lead-free SAC composite solders was observed to decrease.

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    Title:

    Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

    Contributors:

    Tsao, L.C. (author) / Chang, S.Y. (author)

    Publication date:

    2009-08-05

    Size:

    4 pages

    ISSN:

    0261-3069

    DOI:

    https://doi.org/10.1016/j.matdes.2009.08.008

    Type of media:

    Article (Journal)

    Type of material:

    Electronic Resource

    Language:

    English

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