A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CIRCUIT SUBSTRATE AND HEAT DISSIPATION SUBSTRATE OR ELECTRONIC DEVICE PROVIDED WITH SAME
A circuit substrate according to the present disclosure includes: a substrate made of ceramic; a bonding layer positioned on the substrate; and a metal layer positioned on the bonding layer. In addition, the metal layer contains copper. In addition, the bonding layer contains aluminum, silicon, and oxygen.
本发明的电路衬底具备：由陶瓷形成的衬底、位于该衬底之上的接合层、和位于该接合层之上的金属层。另外，金属层含铜。另外，接合层含铝、硅和氧。
CIRCUIT SUBSTRATE AND HEAT DISSIPATION SUBSTRATE OR ELECTRONIC DEVICE PROVIDED WITH SAME
A circuit substrate according to the present disclosure includes: a substrate made of ceramic; a bonding layer positioned on the substrate; and a metal layer positioned on the bonding layer. In addition, the metal layer contains copper. In addition, the bonding layer contains aluminum, silicon, and oxygen.
本发明的电路衬底具备：由陶瓷形成的衬底、位于该衬底之上的接合层、和位于该接合层之上的金属层。另外，金属层含铜。另外，接合层含铝、硅和氧。
CIRCUIT SUBSTRATE AND HEAT DISSIPATION SUBSTRATE OR ELECTRONIC DEVICE PROVIDED WITH SAME
电路衬底及具备它的散热衬底或电子设备
ABE YUICHI (author) / MUNEISHI TAKESHI (author)
2021-11-05
Patent
Electronic Resource
Chinese
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