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Grinding-free ceramic copper-clad plate double-sided simultaneous sintering method
The invention discloses a grinding-free ceramic copper-clad plate double-sided simultaneous sintering method. By designing the shape of a jig and coating the surface of the jig with a ceramic layer, the erosion effect of the jig on a copper sheet is reduced, the erosion mark left on the copper sheet after one-time sintering is processed, the part, reacting with the jig, of the copper sheet at the high temperature is etched away, the lower copper sheet is prepared into a pattern surface. Lifting is carried out by means of the space structure of the jig, the limitation that only an upper copper sheet can be used as a pattern surface in an original double-sided sintering method is overcome, the product category is enriched, the quality and the yield are improved, the use direction of the double-sided simultaneous sintering method is expanded, and the production cost and time are saved.
本发明公开了一种免研磨的陶瓷覆铜板双面同时烧结方法。本发明通过设计治具形状，在治具表面涂覆陶瓷层的方式来减少治具对铜片的侵蚀作用，并通过一次烧结后铜片上留下的侵蚀印记进行加工，将高温下铜片与治具发生反应的部分蚀刻掉，且下方铜片制备为图形面，依靠治具的空间结构进行托举，克服了以往双面烧结法只能用上方铜片作为图形面的局限，丰富了产品类别，提高了品质和良品率，拓展了双面同时烧结法的使用方向，节约生产的成本与时间。
Grinding-free ceramic copper-clad plate double-sided simultaneous sintering method
The invention discloses a grinding-free ceramic copper-clad plate double-sided simultaneous sintering method. By designing the shape of a jig and coating the surface of the jig with a ceramic layer, the erosion effect of the jig on a copper sheet is reduced, the erosion mark left on the copper sheet after one-time sintering is processed, the part, reacting with the jig, of the copper sheet at the high temperature is etched away, the lower copper sheet is prepared into a pattern surface. Lifting is carried out by means of the space structure of the jig, the limitation that only an upper copper sheet can be used as a pattern surface in an original double-sided sintering method is overcome, the product category is enriched, the quality and the yield are improved, the use direction of the double-sided simultaneous sintering method is expanded, and the production cost and time are saved.
本发明公开了一种免研磨的陶瓷覆铜板双面同时烧结方法。本发明通过设计治具形状，在治具表面涂覆陶瓷层的方式来减少治具对铜片的侵蚀作用，并通过一次烧结后铜片上留下的侵蚀印记进行加工，将高温下铜片与治具发生反应的部分蚀刻掉，且下方铜片制备为图形面，依靠治具的空间结构进行托举，克服了以往双面烧结法只能用上方铜片作为图形面的局限，丰富了产品类别，提高了品质和良品率，拓展了双面同时烧结法的使用方向，节约生产的成本与时间。
Grinding-free ceramic copper-clad plate double-sided simultaneous sintering method
一种免研磨的陶瓷覆铜板双面同时烧结方法
LI YAN (author) / HE XIANHAN (author) / ZHU RUI (author) / DONG MINGFENG (author) / CAI JUN (author) / LU YULONG (author)
2022-02-08
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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