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Copper-ceramic bonded body and insulated circuit board
This copper-ceramic bonded body is obtained by bonding a copper member comprising copper or a copper alloy and a ceramic member, and the result of the cross-section of the copper member in the lamination direction is observed. The ratio (D1/D0) of the average crystal grain diameter (D1) at a position 50 [mu] m in the lamination direction from the bonding surface with the ceramic member to the average crystal grain diameter (D0) of the entire copper member is 0.60 or less.
本发明的铜‑陶瓷接合体为接合由铜或铜合金构成的铜部件和陶瓷部件而成的铜‑陶瓷接合体，观察所述铜部件的沿层叠方向的截面的结果，从与所述陶瓷部件的接合面起朝向层叠方向50μm的位置的平均晶粒直径D1与所述铜部件的整体的平均晶粒直径D0之比D1/D0为0.60以下。
Copper-ceramic bonded body and insulated circuit board
This copper-ceramic bonded body is obtained by bonding a copper member comprising copper or a copper alloy and a ceramic member, and the result of the cross-section of the copper member in the lamination direction is observed. The ratio (D1/D0) of the average crystal grain diameter (D1) at a position 50 [mu] m in the lamination direction from the bonding surface with the ceramic member to the average crystal grain diameter (D0) of the entire copper member is 0.60 or less.
本发明的铜‑陶瓷接合体为接合由铜或铜合金构成的铜部件和陶瓷部件而成的铜‑陶瓷接合体，观察所述铜部件的沿层叠方向的截面的结果，从与所述陶瓷部件的接合面起朝向层叠方向50μm的位置的平均晶粒直径D1与所述铜部件的整体的平均晶粒直径D0之比D1/D0为0.60以下。
Copper-ceramic bonded body and insulated circuit board
铜-陶瓷接合体及绝缘电路基板
TAKAKUWA KEI (author) / TERASAKI NOBUYUKI (author) / NISHIMOTO SHUJI (author)
2023-01-31
Patent
Electronic Resource
Chinese