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A platform for research: civil engineering, architecture and urbanism
Processing method of ultrathin ceramic substrate
The invention discloses a processing method of an ultrathin ceramic substrate, which comprises the following steps: firstly, mixing ceramic powder according to a certain weight ratio, and placing in a mold; then, a high-density blank is pressed through isostatic pressing equipment; sintering the obtained blank to obtain a structural ceramic semi-finished product; grinding the structural ceramic semi-finished product to be flat, and performing wire cutting through a ceramic substrate cutting machine to obtain an ultrathin ceramic substrate semi-finished product; placing the semi-finished product of the ultrathin ceramic substrate in a tool, and grinding the semi-finished product through a grinding machine; and finally, the ground ultrathin ceramic substrate is polished through a polishing machine, and a finished product is obtained. Under the condition that the yield is not reduced, the production process is optimized, and the ultra-thin ceramic substrate is formed through one-time grinding.
本发明公开一种超薄陶瓷基片的加工方法，首先将陶瓷粉料按照一定重量比混合，置于模具内；后通过等静压设备，压制出高密度的胚料；接着将得到的胚料进行烧结，得到结构陶瓷半成品；然后将结构陶瓷半成品磨平后通过陶瓷基片切割机进行线切，得到超薄陶瓷基片半成品；再将超薄陶瓷基片半成品置于工装中通过研磨机进行研磨；最后将研磨后的超薄陶瓷基片通过抛光机进行抛光，得到成品。本发明在保证成品率不下降的情况下，优化生产工艺，一次研磨成型极薄的超薄陶瓷基片。
Processing method of ultrathin ceramic substrate
The invention discloses a processing method of an ultrathin ceramic substrate, which comprises the following steps: firstly, mixing ceramic powder according to a certain weight ratio, and placing in a mold; then, a high-density blank is pressed through isostatic pressing equipment; sintering the obtained blank to obtain a structural ceramic semi-finished product; grinding the structural ceramic semi-finished product to be flat, and performing wire cutting through a ceramic substrate cutting machine to obtain an ultrathin ceramic substrate semi-finished product; placing the semi-finished product of the ultrathin ceramic substrate in a tool, and grinding the semi-finished product through a grinding machine; and finally, the ground ultrathin ceramic substrate is polished through a polishing machine, and a finished product is obtained. Under the condition that the yield is not reduced, the production process is optimized, and the ultra-thin ceramic substrate is formed through one-time grinding.
本发明公开一种超薄陶瓷基片的加工方法，首先将陶瓷粉料按照一定重量比混合，置于模具内；后通过等静压设备，压制出高密度的胚料；接着将得到的胚料进行烧结，得到结构陶瓷半成品；然后将结构陶瓷半成品磨平后通过陶瓷基片切割机进行线切，得到超薄陶瓷基片半成品；再将超薄陶瓷基片半成品置于工装中通过研磨机进行研磨；最后将研磨后的超薄陶瓷基片通过抛光机进行抛光，得到成品。本发明在保证成品率不下降的情况下，优化生产工艺，一次研磨成型极薄的超薄陶瓷基片。
Processing method of ultrathin ceramic substrate
一种超薄陶瓷基片的加工方法
WANG CHUNTANG (author) / WU MEIHE (author)
2023-06-30
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
B28D
Bearbeiten von Stein oder steinähnlichen Werkstoffen
,
WORKING STONE OR STONE-LIKE MATERIALS
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