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Sputtering target material and method for manufacturing sputtering target material
Provided are a novel sputtering target material and a method for producing a sputtering target material. The sputtering target material comprises a first area and a second area. The first region includes a first metal oxide containing an element M1 (element M1 is one or more selected from the group consisting of Al, Ga, Si, Mg, Zr, and B). The second region includes a second metal oxide containing indium and zinc. The first region and the second region are separated from each other. The first region and the second region are each a crystal grain. A grain boundary is observed between the first region and the second region. Each of the first region and the second region has a diameter of 5 nm or more and 10 [mu] m or less.
提供一种新颖的溅射靶材及溅射靶材的制造方法。溅射靶材包括第一区域及第二区域。第一区域包括含有元素M1(元素M1为选自Al、Ga、Si、Mg、Zr及B中的一种或多种)的第一金属氧化物。第二区域包括含有铟及锌的第二金属氧化物。第一区域与第二区域彼此分离。第一区域及第二区域各自为晶粒。第一区域与第二区域之间观察到晶界。第一区域及第二区域各自的径为5nm以上且10μm以下。
Sputtering target material and method for manufacturing sputtering target material
Provided are a novel sputtering target material and a method for producing a sputtering target material. The sputtering target material comprises a first area and a second area. The first region includes a first metal oxide containing an element M1 (element M1 is one or more selected from the group consisting of Al, Ga, Si, Mg, Zr, and B). The second region includes a second metal oxide containing indium and zinc. The first region and the second region are separated from each other. The first region and the second region are each a crystal grain. A grain boundary is observed between the first region and the second region. Each of the first region and the second region has a diameter of 5 nm or more and 10 [mu] m or less.
提供一种新颖的溅射靶材及溅射靶材的制造方法。溅射靶材包括第一区域及第二区域。第一区域包括含有元素M1(元素M1为选自Al、Ga、Si、Mg、Zr及B中的一种或多种)的第一金属氧化物。第二区域包括含有铟及锌的第二金属氧化物。第一区域与第二区域彼此分离。第一区域及第二区域各自为晶粒。第一区域与第二区域之间观察到晶界。第一区域及第二区域各自的径为5nm以上且10μm以下。
Sputtering target material and method for manufacturing sputtering target material
溅射靶材及溅射靶材的制造方法
YAMAZAKI SHUNPEI (author) / SATO YUICHI (author) / ISAKA FUMITO (author) / ONO TOSHIKAZU (author)
2023-12-29
Patent
Electronic Resource
Chinese
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