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Composite aluminum nitride substrate and preparation method and application thereof
The invention belongs to the technical field of packaging, and particularly relates to a composite aluminum nitride substrate and a preparation method and application thereof. The preparation method of the composite aluminum nitride substrate comprises the following steps: preparing a modified diamond whisker with the surface modified with an inorganic affinity group; the modified diamond whiskers and aluminum nitride powder are mixed, and mixed powder is prepared; and pressing the mixed powder into a green body, and sintering the green body to obtain the composite aluminum nitride substrate. According to the composite aluminum nitride substrate, the modified diamond whiskers are doped among the aluminum nitride particles, and a three-dimensional network structure is formed among the aluminum nitride particles, so that the prepared composite aluminum nitride substrate has excellent mechanical strength and bending resistance while having excellent heat conductivity, and becomes an ideal material suitable for heat dissipation of high-power electronic equipment.
本申请属于封装技术领域，尤其涉及一种复合氮化铝基板及其制备方法和应用。复合氮化铝基板的制备方法包括步骤：制备表面修饰有亲无机物基团的改性金刚石晶须；将所述改性金刚石晶须与氮化铝粉末进行混合处理，制成混合粉料；将所述混合粉料压制成生坯后，对所述生坯进行烧结处理，得到复合氮化铝基板。通过改性金刚石晶须掺杂在氮化铝颗粒之间，并在氮化铝颗粒之间形成三维网络结构，使制得的复合氮化铝基板，在具备优秀的热导率的同时，还具备出色的机械强度和抗弯折特性，使其成为适用于高功率电子设备散热的理想材料。
Composite aluminum nitride substrate and preparation method and application thereof
The invention belongs to the technical field of packaging, and particularly relates to a composite aluminum nitride substrate and a preparation method and application thereof. The preparation method of the composite aluminum nitride substrate comprises the following steps: preparing a modified diamond whisker with the surface modified with an inorganic affinity group; the modified diamond whiskers and aluminum nitride powder are mixed, and mixed powder is prepared; and pressing the mixed powder into a green body, and sintering the green body to obtain the composite aluminum nitride substrate. According to the composite aluminum nitride substrate, the modified diamond whiskers are doped among the aluminum nitride particles, and a three-dimensional network structure is formed among the aluminum nitride particles, so that the prepared composite aluminum nitride substrate has excellent mechanical strength and bending resistance while having excellent heat conductivity, and becomes an ideal material suitable for heat dissipation of high-power electronic equipment.
本申请属于封装技术领域，尤其涉及一种复合氮化铝基板及其制备方法和应用。复合氮化铝基板的制备方法包括步骤：制备表面修饰有亲无机物基团的改性金刚石晶须；将所述改性金刚石晶须与氮化铝粉末进行混合处理，制成混合粉料；将所述混合粉料压制成生坯后，对所述生坯进行烧结处理，得到复合氮化铝基板。通过改性金刚石晶须掺杂在氮化铝颗粒之间，并在氮化铝颗粒之间形成三维网络结构，使制得的复合氮化铝基板，在具备优秀的热导率的同时，还具备出色的机械强度和抗弯折特性，使其成为适用于高功率电子设备散热的理想材料。
Composite aluminum nitride substrate and preparation method and application thereof
复合氮化铝基板及其制备方法和应用
ZHENG LESHANG (author) / XIONG QIANG (author) / LIU ZHENGYAN (author) / CHEN ZHIMING (author)
2024-08-16
Patent
Electronic Resource
Chinese
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