A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
To provide a copper/ceramic joint, an insulated circuit board, a copper/ceramic joint producing method, an insulated circuit board producing method, in which reliability of joint between a copper member and a ceramic member can be ensured even when a severe cooling cycle is applied, and the ceramic member and the copper member can be suppressed from being peeled off even when ultrasonic joining is executed.SOLUTION: There is provided a Copper/Ceramic joint 10 formed by joining a copper member 12 made of copper or a copper alloy and a ceramic member 11 made of oxygen-containing ceramics. A magnesium oxide layer 41 is formed between the copper member 12 and the ceramic member 11 at the side of the ceramic member 11. In a copper layer 45 in contact with the magnesium oxide layer 41, an active metal oxide phase composed of oxides of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても銅部材とセラミックス部材との接合信頼性を確保でき、超音波接合を行った場合であってもセラミックス部材と銅部材との剥離を抑制することが可能な銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、酸素含有セラミックスからなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、銅部材１２とセラミックス部材１１との間においては、セラミックス部材１１側に酸化マグネシウム層４１が形成されており、酸化マグネシウム層４１と接する銅層４５の内部に、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の酸化物からなる活性金属酸化物相が分散している。【選択図】図２
COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
To provide a copper/ceramic joint, an insulated circuit board, a copper/ceramic joint producing method, an insulated circuit board producing method, in which reliability of joint between a copper member and a ceramic member can be ensured even when a severe cooling cycle is applied, and the ceramic member and the copper member can be suppressed from being peeled off even when ultrasonic joining is executed.SOLUTION: There is provided a Copper/Ceramic joint 10 formed by joining a copper member 12 made of copper or a copper alloy and a ceramic member 11 made of oxygen-containing ceramics. A magnesium oxide layer 41 is formed between the copper member 12 and the ceramic member 11 at the side of the ceramic member 11. In a copper layer 45 in contact with the magnesium oxide layer 41, an active metal oxide phase composed of oxides of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても銅部材とセラミックス部材との接合信頼性を確保でき、超音波接合を行った場合であってもセラミックス部材と銅部材との剥離を抑制することが可能な銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、酸素含有セラミックスからなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、銅部材１２とセラミックス部材１１との間においては、セラミックス部材１１側に酸化マグネシウム層４１が形成されており、酸化マグネシウム層４１と接する銅層４５の内部に、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の酸化物からなる活性金属酸化物相が分散している。【選択図】図２
COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (author)
2021-03-01
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2023
| European Patent Office | 2023