A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD
A method of producing a circuit board of the present invention includes a step of placing, on a semi-cured composite sheet (10), a plate-shaped member (30) having an opening (31); a step of fitting a metal foil cut product (20) into the opening (31) of the plate-shaped member (30) and placing the metal foil cut product (20) on the semi-cured composite sheet (10) on which the plate-shaped member (30) has been placed; a step of pressurizing, while heating, the semi-cured composite sheet (10) on which the plate-shaped member (30) and the metal foil cut product (20) have been placed to produce a first laminate; and a step of removing the plate-shaped member (30) from the first laminate to produce a second laminate, where the absolute value of the difference between the thickness of the metal foil cut product (20) and the thickness of the plate-shaped member (30) is 0.25 mm or less, and the dielectric breakdown voltage is 3.5 kV or more. According to the present invention, it is possible to provide a method of producing a circuit board capable of suppressing occurrence of cracks in a semi-cured composite sheet that contains a porous ceramic and a semi-cured product of a thermosetting composition filling voids of the porous ceramic even when a metal foil cut product obtained by cutting a metal foil is attached to the semi-cured composite sheet and pressure is applied thereto.
METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD
A method of producing a circuit board of the present invention includes a step of placing, on a semi-cured composite sheet (10), a plate-shaped member (30) having an opening (31); a step of fitting a metal foil cut product (20) into the opening (31) of the plate-shaped member (30) and placing the metal foil cut product (20) on the semi-cured composite sheet (10) on which the plate-shaped member (30) has been placed; a step of pressurizing, while heating, the semi-cured composite sheet (10) on which the plate-shaped member (30) and the metal foil cut product (20) have been placed to produce a first laminate; and a step of removing the plate-shaped member (30) from the first laminate to produce a second laminate, where the absolute value of the difference between the thickness of the metal foil cut product (20) and the thickness of the plate-shaped member (30) is 0.25 mm or less, and the dielectric breakdown voltage is 3.5 kV or more. According to the present invention, it is possible to provide a method of producing a circuit board capable of suppressing occurrence of cracks in a semi-cured composite sheet that contains a porous ceramic and a semi-cured product of a thermosetting composition filling voids of the porous ceramic even when a metal foil cut product obtained by cutting a metal foil is attached to the semi-cured composite sheet and pressure is applied thereto.
METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD
VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE UND LEITERPLATTE
PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ, ET CARTE DE CIRCUIT IMPRIMÉ
INOUE SAORI (author) / YAMAGATA TOSHITAKA (author) / KANEKO ERI (author) / YOSHIMATSU RYO (author) / KOGA RYUJI (author)
2024-01-03
Patent
Electronic Resource
English
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